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Intel Sr. Thermal Mechanical Architect in Hillsboro, Oregon

Job Description

Join Intel's Thermal-Mechanical Systems Engineering team inside the Client Computing Group and help us solve platform-level thermal and mechanical challenges! We are looking for an experienced engineer who is self-motivated and driven to identifies and solve new problems that arise as we increase computing power with increased power density while driving for smaller and smaller systems.

This is a senior leadership position and the successful candidate will quickly become a team leader who helps drive decision-making and improvements within the team.

Responsibilities include, but are not limited to:

  • Architect platform-level thermal-mechanical solutions to CCG's roadmap challenges ranging from small fanless systems to large high-end desktops and everything in-between

  • Work across organizational boundaries to plan and prioritize the team's system-level thermal/mechanical design and analysis.

  • Work directly with Platform Architects to define thermal-mechanical aspects of the platform landing zones including gen over gen improvements

  • Work with the silicon design and packaging teams to optimize CCG's upcoming products to make them easy to integrate into systems from a thermal-mechanical perspective.

  • Identify and support the enabling of new technologies to improve the thermal performance of Intel systems.

  • Support customer thermal or mechanical escalations and solve customer issues.

  • Present technical updates to upper management

  • Help set the team's strategic direction - identify areas where the team should focus resources to address future challenges.

  • Mentor more junior team members and help them improve both their technical and business acumen.


You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's degree or higher in Mechanical Engineering, Thermal Engineering or Physics

10+ years' experience solving thermal and mechanical challenges in the electronics industry

10+ years of experience in the following:

  • Deep technical knowledge and experience with analyzing and designing thermal solutions for PCs

  • Understanding and knowledge of manufacturing processes and constraints for Client Computers including cost and HVM constraints.

  • Demonstrated communication skills - ability to break down and explain complex technical issues to non-technical partner organizations and upper management

Preferred Experience:

Master's Degree or higher in Mechanical Engineering, Thermal Engineering or Physics

  • Deep technical knowledge and experience with analyzing and designing

Inside this Business Group

The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.