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Intel Oregon Die Prep Process Engineer in Hillsboro, Oregon

Job Description

The Oregon Die Prep (ODP) Process Engineer is responsible for, but not be limited to:

  • Design and plan the layout for such processes as hardening, washing, laminating, etching, engraving, polishing, painting, plating, and other material processing operations.

  • Plan sequence of operations and specifies procedures for cutting, shaping, and otherwise preparing basic material, exercising judgment in compromising between conflicting requirements, economic evaluation of methods, and operator effectiveness and comfort.

  • Conducts tests and measurements throughout stages of production to determine control over such variables as temperature, density, specific gravity, pressure, and viscosity.

  • Establishes and submits processing requirements to be met in designing and acquiring processing equipment.

  • Responds to customer/client requests or events as they occur.

  • Develops solutions to problems utilizing formal education and judgement.

This is an entry level position and will be compensated accordingly.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through schoolwork, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

  • Candidates must possess a Master's or PhD degree in Physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, or other related fields.

  • Minimum of 1 year of fab or assembly experience.

Preferred Qualifications:

  • Experience with die prep equipment and/or Lean principles.

  • Knowledge of statistical process control techniques, data analysis, and Intel's change control system (PCCB).

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance....

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