Intel Memory Design and Development Engineer in Hillsboro, Oregon
Component Design Engineers are responsible for the design and development of electronic components. Responsibilities may include: the design of chip layout circuit design, circuit checking, device evaluation and characterization, documentation of specifications, prototype construction and checkout, modification and evaluation of semiconductor devices and components, performing developmental and/or test work, reviewing product requirements and logic diagrams, planning and organizing design projects or phases of design projects. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgement.
Candidate should possess a M.S. in Electrical/Computer Engineering + 3 years of industry experience or Ph.D. in Electrical/Computer Engineering.
Minimum of 3 years of experience in memory design and technology development, including SRAM, DRAM, ROM, eFuse, and Emerging Memories.
Minimum of 3 years of experience in Spice level simulation, layout, RTL writing and functional validation, floorplan, place and route, synthesis flows
Minimum of 3 years of experience in Process integration, transistor and back end flows and design rules
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
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